Desco Tape Wescorp Esd Polyimide Hi Temp 6 MM X 32.9 M vendor_BONDHUS glass and metals

glass and metals

1 pc 1/2" universal joint

Brady Hard Carry Case for BMP21 & BMP21-PLUS Overview

Print Speed (mm/sec)

Auto and manual ranging respectively for quick checks and precise measurements

Desco Tape Wescorp Esd Polyimide Hi Temp 6 MM X 32.9 M vendor_BONDHUS glass and metalsOverview Removal leaves little or no residue Masking off PCBs for IR reflow ovens or wave soldering under 572F (300C) ~ 10 seconds Near zero voltage generation when tape removed from PCB (at 50% relative humidity) Near zero voltage generation when tape unrolled from roll (at 50% relative humidity) Low sloughing plastic core Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits For best results apply